Reliability Assessment of Cycloaliphatic Epoxy Encapsulation for Next-Generation Power Modules

Takuya Nakagiri, Aiji Suetake, Keiko Ohtsuka, Yoshie Amemiya, Motoharu Haga, Hiroto Takenaka, Koji Nakatani, Xudong He, Hirose Suzuki, Mitsuteru Mutsuda, Masahiko Nishijima, Katsuaki Suganuma

International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2025)

Anti-Oxidation Sintering of Ag-10Cu Composite Paste on DBC Substrate in Air Atmosphere

F Huo, C Chen, S Lee, D Kim, P Liu, K Takeshita, Y Yamaguchi, Y Momose, K Suganuma

2025 26th International Conference on Electronic Packaging Technology (ICEPT 2025, Shanghai, China) 1-4. DOI：10.1109/ICEPT67137.2025.11157396.

Growth of Nanovoids in Electroless Cu Layer of Micro-Via After Thermal Reliability Test

M Nishijima, M-C Hsieh, Z Zhang, A Suetake, R Okumura, H Yoshida, C Chen, H Seto, Y Kitahara, K Hashizume, K Yamanaka, K Suganuma

2025 IEEE 75th Electronic Components and Technology Conference (ECTC) 1055-1060. DOI: 10.1109/ECTC51687.2025.00184.

Cost-Performance Silver-Aluminum Composite Sinter Paste with Improved Joint Reliability in SiC Power Device Applications

C Chen, F Huo, K Takeshita, H Miyake, K Suganuma

2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) 143-144. DOI：10.23919/ICEP-IAAC64884.2025.11002880.

Elemental Characterization for Electroless Cu Interface Layer of Stacked Micro-Via in Substrate by STEM and ToF-SIMS

M Nishijima, M-C Hsieh, Z Zhang, A Suetake, R Okumura, H Yoshida, C Chen, H Seto, Y Kitahara, K Hashizume, K Yamanaka, K Suganuma

2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) 11-12. DOI：10.23919/ICEP-IAAC64884.2025

Evaluating the Performance of Micro-Bump Flip-Chip Packaging Enhanced by Copper Paste

R Liu, Z Zhang, M Nishijima, C Chen, H Sakamoto, A Happoya, C Chen, K Suganuma

25th International Conference on Electronic Packaging Technology (ICEPT 2024, Tianjin, China) 1-4. DOI:10.1109/ICEPT63120.2024.10668752.

Improvement of Bonding Strength for Ag Sinter Joining Direct on Al Heatsink in SiC Power Module

C Chen, K Suganuma, K Kobayashi

25th International Conference on Electronic Packaging Technology (ICEPT 2024, Tianjin, China) DOI: 1-4. 10.1109/ICEPT63120.2024.10668619

Bare Cu Bonding by Cu-Ag Composite Paste in Low Temperature Low Pressure Air Sintering

C Chen, T Sekiguchi, K Suganuma

2024 International Conference on Electronics Packaging (ICEP 2024, Toyama, Japan)

Quantitative Elemental Characterization for Electroless Cu Plating Interface of Micro-via by ToF-SIMS

M Nishijima, M-C Hsieh, Z Zheng, R Okumura

2024 International Conference on Electronics Packaging (ICEP 2024, Toyama, Japan)

Low-Temperature and Low-Pressure Fine-Pitch Micro Cu Bump Bonding Using Stress Migration of a Sputtering Ag Layer

Z Zhang, A Suetake, R Liu, H Yoshida, R Okumura, C Chen, K Suganuma

2024 International Conference on Electronics Packaging (ICEP 2024, Toyama, Japan)

Development of Thermal Characteristics Evaluation System for Multi-Chip SiC Power Modules

F Huo, C Chen, Z Zhang, A Suetake, K Takeshita, Y Yamaguchi, Y Momose, K Suganuma

2024 International Conference on Electronics Packaging (ICEP 2024, Toyama, Japan)

ToF-SIMS Characterization for Electroless Plating Copper Interface Layer of Micro-via

Masahiko Nishijima, Ming-chun Hsieh, Zheng Zhang, Aiji Suetake, Hiroyoshi Yoshida, Rieko Okumura, Chuantong Chen, Hiroki Seto, Hidekazu Homma, Yuhei Kitahara, Koji Kita, and Katsuaki Suganuma

International Microsystem, Package, Assembly and Circuits Technology conference (IMPACT 2023)

Influence of Interfacial Interaction on The Reliability of The Copper/Epoxy Bond Under 85 ℃/85 %RH Test

Shuaijie Zhao, Chuantong Chen, Rieko Okumura, Minoru Ueshima, Motoharu Haga, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma

18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2023), Oct. 25th-27th 2023, Taipei, Taiwan

The Effects of Voids Existence in Micro-via on the Thermal Reliability (Invited)

Ming-chun Hsieh, Aiji Suetake, Hiroyoshi Yoshida, Masahiko Nishijima, Rieko Okumura, Zheng Zhang, Chuantong Chen, Hiroyuki Seto, Yu Shimizu, Yuhei Kitahara, Koji Kita, Hirokazu Tanaka, Teruyoshi Hisada, Katsuaki Suganuma

18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2023), Oct. 25th-27th 2023, Nangang International Exhibition Center, Taipei, Taiwan

Influence of interfacial interaction between various metal substrates and epoxies on bonding reliability under high temperature

Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma

International Microelectronics Assembly & Packaging Society (IMAPS) Symposium 2023, October 3-5, 2023, San Diego

Microstructure Evolution and Online Thermal Resistance of AgSintered SiC/DBA Power Module During Power Cycling

Fupeng Huo ; Ye Wang; Chuantong Chen; Zheng Zhang ; Yoshiji Yamaguchi ; Naoki Wakasugi ; Aiji Suetake ; Katsuaki Suganuma

International Microelectronics Assembly & Packaging Society (IMAPS Symposium 2023)

Structural investigation of nanovoids around the interface of micro-vias by spherical aberration corrected scanning transmission electron microscopy

M.C. Hsieh, M. Nishijima, K. Jogo, Z. Zhang, R. Okumuara, H. Yoshida, C. Chen, A. Suetake, H. Honma, H. Seto, Y. Kitahara, K. Kita, K. Suganuma

34th European Symposium on Reliability of Electon Devices, Failure Physics and Analysis (ESREF 2023)

Enhanced reliability for power modules via a new Ag/Si sinter joining strategy

Yang Liu, Chuantong Chen, Koji S. Nakayama, Minoru Ueshima, Takeshi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Katsuaki Suganuma

The 24th European Microelectronics & Packaging Conference (2023EMPC), 11-14 September, Wellcome Genome Campus, Hinxton, UK

An abnormal phenomenon observed for copper/epoxy bonding after 85°C/85% relative humidity test and its possibile mechanism

Shuaijie Zhao, Chuantong Chen, Minoru Ueshima, Motoharu Haga, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma

MES2023（第33回マイクロエレクトロニクスシンポジウム）, 2023年9月6日(水)～8日(金), 大同大学, 名古屋

Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layer

Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Katsuaki Suganuma

2023 24th International Conference on Electronic Packaging Technology (ICEPT), August 8-11, 2023, Xinjiang, China

Fine Pitch Micro Via Interconnection with Reliable Electroless/electric Cu plating Layers Combined with High Power DUV Picosecond Laser for Organic Substrates

Ming-chun HSIEH, Zheng ZHANG, Masahiko NISHIJIMA, Aiji SUETAKE, Chuantong CHEN, Hiroyoshi YOSHIDA, Wangyun LI, Rieko OKUMURA, Hidekazu HOMMA, Koji KITA, George OKADA, Katsuaki SUGANUMA

The 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC2023), 30 May-2 June 2023, JW Marriot Orlando & Grand Lakes Orlando, Orlando, FL, USA

Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

Shuaijie Zhao, Chuantong Chen, Minoru Ueshima, Motoharu Haga, Katsuaki Suganuma

International Conference on Electronics Packaging (ICEP2023), 2023年4月19日-22日, 市民会館シアーズホーム夢ホール(熊本県)

Pattern Design of SiC-TEG Heater Chip with Uniform Temperature Distribution Applied in Power Module Packaging

Fupeng Huo; Ye Wang; Chuantong Chen; Peihao Geng; Luobin Zhang; Yoshiji Yamaguchi; Katsuaki Suganuma

2023 International Conference on Electronics Packaging (ICEP)

Effect of Aging and Thermal Shock on the Reliability of Silver Sintered Die Attach for SiC Power Devices

Wangyun Li; Chuantong Chen; Yang Liu; Minoru Ueshima; Takeshi Sakamoto; Katsuaki Suganuma

2023 International Conference on Electronics Packaging (ICEP)

A Novel and Cost-Effective Ag/Si Composited Paste With Highly Stable Microstructure Maintaince in Thermal Shock Cycles

Yang Liu, Chuantong Chen, Minoru Ueshima, Takeshi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Katsuaki Suganuma

International Conference on Electronics Packaging (ICEP2023), 市民会館シアーズホーム夢ホール(熊本県)

Reliability Evaluation of SiC/Cu Substrate Die-attached Module with Sintered Cu Joint and Pb-free Solder

Ming-chun Hsieh, Aiji Suetake, Zheng Zhang, Rieko Okumura, Kei Anai, Satoshi Konno, Katsuaki Suganuma

International Conference on Electronics Packaging (ICEP2023), 19-23 April 2023, Kumamoto City Searshome Yume Hall, Kumamoto, Japan

Study of Cu Micro-via by TOF-SIMS and STEM

Masahiko Nishijima, Ming-Chun Hsieh, Zhang Zheng, Aiji Suetake, Hiroshi Yoshida, Rieko Okumuara, Chuantong Chen, Hidekazu Homma, Koji Kita, Katsuaki Suganuma

2023 International Conference on Electronics Packaging (ICEP 2023)

Influences of Deposition Speed on Void Formation in Electroless Copper Plating Film for Micro-vias

Ming-chun Hsieh, Zheng Zhang, Masahiko Nishijima, Chuantong Chen, Hidekazu Honma, Yu Shimizu, Koji Kita, Joonhaeng Kang, Takashi Mitsunami, Kuniaki Otsuka, Katsuaki Suganuma

The Minerals, Metals & Materals Society (TMS), 152nd Annual Meeting & Exhibition,19-23 March , San Diego Convention Center & Hilton San Diego Bayfront , San Diego, CA, USA

Characterization and TEM analysis of electroless Ni-P plating film with various P and S content

Ming-chun Hsieh, Chuantong Chen, Masahiko Nishijima, Ryuji Saito, Norihiko Hasegawa, Kei Hashizume, Kuniaki Otsuka, Katsuaki Suganuma

17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2022), Oct. 26th-28th 2022, Nangang International Exhibition Center, Taipei, Taiwan

Effects of Ni existence on void formation in micro-vias of high-density interconnect (HDI)

Ming-chun Hsieh, Zheng Zhang, Jeyun Yeom, Aiji Suetake, Hiroyoshi Yoshida, Chuantong Chen, Masahiko Nishijima, Joonhaeng Kang, Hidekazu Honma, Yu Shimizu, Yuhei Kitahara, Koji Kita, Takashi Matsunami, Kuniaki Otsuka, and Katsuaki Suganuma

17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2022), Oct. 26th-28th 2022, Nangang International Exhibition Center, Taipei, Taiwan

Reliability of Sintered Cu joint on Cu substrate with or without Ag metallization

Ming-chun Hsieh, Aiji Suetake, Zheng Zhang, Kei Anai, Katsuaki Suganuma

International Conference on Electronics Packaging (ICEP2022), 11-14 May 2022, Sapporo Community Plaza, Sapporo, Hokkaido, Japan

銀ペーストとセラミックス、半導体との低温無加圧直接焼結接合技術

陳伝彤, 張政、菅沼克昭

第36回エレクトロニクス実装学会講演大会, 2022年3月24日

Low-Temperature and Low-Pressure Ag Sinter Joining for Robust SiC Assembly(Invited)

K. Suganuma

Electronic Packaging and Interconnection Materials (EPIM) Committee, TMS, March 1, on-line, 2022

Reliable packaging technology for heat-resistant SiC power modules (Invited)

K. Suganuma, C. Chen, Z. Zhang, A. Suetake

14th Pacific Rim Conference on Ceramic and Glass Technology (PACRIM); Glass & Optical Materials Division Meeting (GOMD), American Ceramic Society, on-line, December 13 - 16 (2021).

Micro-Flake Ag Particles Sinter Joining for High Temperature Power Modules in a Low Temperature Pressure Less Conditions(Invited)

C. Chen, K. Suganuma

Global Summit on Electronics & Electrical Engineering(GSEEE), November 08, 2021

Reinforcement of DBA Substrate for Fatigue-Resistant Ag-Au Joining in SiC Power Modules(Invited)

Y. Liu, C. Chen, K. Suganuma

Global Summit on Electronics & Electrical Engineering(GSEEE), November 08, 2021

Micro structure of Weak-Micro-Via and its Failure Prevention

Ming-chun Hsieh, Jeyun Yeom, Zheng Zhang, Aiji Suetake, Hiroshi Yoshida, Chuantong Chen, Katsuaki Suganuma, Joonhaeng Kang, Hidekazu Honma, Yuhei Kitahara, Takashi Matsunami and Kuniaki Otsuka

2021 SMTA International - Surface Mount Technology Association, November 2021

Microstructure of Weak-Micro-Via and its Failure Prevention

K.i Suganuma, J. Yeom, M.-C. Hsieh, Z. Zheng, A. Suetake, H. Yoshida, C. Chen, J. Kang, H. Honma, Y. Kitahara, T. Matsunami, K. Otsuka

SMTA International 2022, on-line, October 31st- November 3rd, (2021).

熱流センサーによる高温実装基板熱性能評価のための定常熱抵抗測定技術の開発

陳 伝彤, 菅沼 克昭, 大串 哲朗, 須崎 純一

第57回熱測定討論会, 2021年10月27日（水）～ 2021年10月29日（金）

Advanced bonding technology by Ag Sinter Joining in High Temperature Application in SiC Power Modules(Invited)

C. Chen, K. Suganuma

3rd Global Summit On Physics, October 21-23, 2021 | Virtual

Advanced Packaging Technology of Excellent Thermal Performance with Sinter Joining(Plenary)

Katsuaki Suganuma, Chuantong Chen, Zheng Zhang, Aiji Suetake, Ming-Chun Hsieh

International Conference on Electronic Packaging Technology (ICEPT2021), Xiamen, China, online, (2021.9.15)

Advances in Ag Sinter Joining and real‐time failure monitoring for WBG Power Device

C. Chen, Z. Zhang, T. Takemasa, N. Wakasugi, A. Suetake, K. Suganuma

3rd International Symposium on 3D Power Electronics Integration & Manufacturing(3D-PEIM), June 22, 2021

Low temperature Cu sinter joining on different metallization substrates and its reliability evaluation with a high current density

Chuantong Chen, Aya Iwaki, Aiji Suetake, Kazuhiko Sugiura, Kiyoshi Kanie, Katsuaki Suganuma

2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) 30 May-3 June 2021

Development of Solder Deterioration Diagnosis System of a Power Module via the Acoustic Emission Monitoring (AEM) Technique

Zheng Zhang, Aiji Suetake, Chuantong Chen, Hiroshi Ishino, Hirokazu Sampei, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Katsuaki Suganuma

2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) 30 May-3 June 2021

Novel approach of die attach technology for SiC power module by pure Al thin film bonding

Chuantong Chen, Katsuaki Suganuma

2021 International Conference on Electronics Packaging (ICEP) 12-14 May 2021

Pressureless and low temperature direct bonding on Si, SiC and GaN via Ag paste sinter-joining

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma

2021 International Conference on Electronics Packaging (ICEP) 12-14 May 2021

Pressureless and Low Temperature Direct Bonding on Si, SiC and GaN via Ag Paste Sinter-joining

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma

2021 International Conference on Electronics Packaging (ICEP), May 2, 2021

Tin whisker growth in space (Invited)

K. Suganuma, N. Nemoto, S. Kan, S. Ichimaru, T. Nakagawa

TMS 2022 151th Annual Meeting & Exhibition, March 15-18, on-line, (2021).

Die-bonding performance and mechanism of Ag micron paste with pressure-less sintering

T. Takemasa, C. Chen, K. Suganuma

TMS 2022 151th Annual Meeting & Exhibition, March 15-18, on-line, (2021).

Advances in low temperature/low pressure Ag sinter joining and its thermal performance(invited)

Katsuaki Suganuma, Chuantong Chen, Zheng Zhang, Aiji Suetake, Aya Iwaki, Ming-Chun Hsieh, and Naoki Satoh

TMS 2021 150th Annual Meeting & Exhibition, March 15-18, 2021

Reliability Evaluation of Ag Sinter-Joining Die Attach Under a Harsh Thermal Cycling Test

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma

TMS 2021 150th Annual Meeting & Exhibition, March 15-18, 2021, Virtual conference.

AE Monitoring of Fatigue Damage of Al Ribbon Bonding for Power Electronic Devices During Power Cycling Test

Katsuaki Suganuma, Chanyang Choe, Chuantong Chen

53rd International Symposium on Microelectronics, (IMAPS 2020), October 4-9, 2020, Virtual conference.

Advances in Ag Sinter Joining for WBG Power Device Assembly and High Temperature Reliability(invited)

Katsuaki Suganuma, Chuantong Chen, Zheng Zhang, Aishi Suetake, Ming Chun Hsieh, Aya Iwaki

Pacific Rim Meeting on Electrochemical and Solid State Science (PRiME 2020), October 4-9, 2020, Virtual conference.

Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates

Chuantong Chen, Zheng Zhang, Katsuaki Suganuma

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), SEP 15-18, 2020, Virtual conference.

Thermal evaluation of metalized ceramic substrates for use in next-generation power modules toward international standardization

Naoki Wakasugi, Chuantong Chen, Kiyoshi Hirao, Shijo Nagao, Katsuaki Suganuma

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), SEP 15-18, 2020, Virtual conference.

Advanced SiC power module packaging technology direct on DBA substrate for high temperature applications: Ag sinter joining and encapsulation resin adhesion

Chuantong Chen, Zheng Zhang, Katsuaki Suganuma

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), May26-29, 2020, Virtual conference.

Advanced SiC power module packaging technology direct on DBA substrate for high temperature applications

Chuantong Chen, Zheng Zhang, Dongjin Kim, Katsuaki Suganuma

2020 IEEE Applied Power Electronics Conference and Exposition (APEC) ,15-19 March 2020. New Orleans, LA, USA.

Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature

Chuantong Chen, Chanyang Choe, Aiji Suetake, Katsuaki Suganuma

TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings, February 23-27, 2020 | San Diego, California, USA.

Sinter Joining Technology for WBG(Plenary)

K. Suganuma

21th International Symposium on Eco-Materials Processing and Design, Univ. Science and Technology Beijing/ IU-MRS, Yantai, China, January 12-15, 2020.