Symmetry breaking of paracrystalline topology in amorphous silicon

K.S. Nakayama, M. Nishijima, Y. Zhang, K. Inoue, C. Chen, M. Ueshima

Scientific Reports, 15, 31539, (2025)

DOI : 10.1038/s41598-025-15737-8

Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging

C. Chen, L. Zhang, F. Huo, M. Ueshima, Y. Su, X. Long, K.S. Nakayama,

Journal of Materials Science & Technology, 253, 246-257, (2025)

DOI : 10.1016/j.jmst.2025.07.042

The impact of sintered Ag–Al interconnects on the power cycling reliability of die attachments

F. Huo, C. Chen, Z. Zhang, S. Lee, D. Kim, Y. Zhang, A. Suetake, T. Kazutaka, Y. Yamaguchi, Y. Momose, K. Suganuma

IEEE Transactions on Power Electronics, (2025)

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Copper-based composite sintering materials and reliability analysis for power electronics packaging

X. Wang, Z. Yang, L. Bian, W. Liu, G. Zhang, J. Zhang, C. Chen, P. Liu

Journal of Science: Advanced Materials and Devices, 10, 100963, (2025)

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Quartet structure generation set algorithm based 3D reconstruction on porous structures of sintered copper joints for power electronics packaging

W. Liu, X. Wang, J. Zhang, G. Zhang, C. Chen, P. Liu

Scripta Mater, 265, 116750, (2025)

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Computer-designed SphereFlake hybrid pastes enabling high performance pressureless Cu sinter joining on diverse metalized surfaces

W.L. Li, Y.J. Wang, Z.H. Zhu, S. Ding, H.D. Yan, C. Chen, K. Li

cMat, 2, e70008, (2025)

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ポリロタキサン変性によるマレイミド樹脂の高性能化

大塚恵子

ネットワークポリマー論文集, 46, 36-44, (2025)

DOI : doi.org/10.11364/networkedpolymer.46.1_36

Toughening of bismaleimide and benzoxazine alloy with allyl group by incorporation of polyrotaxane

Keiko Ohtsuka, Shuichi Nakao, Yoshiro Hatanaka

Polymer, 320, 127979, (2025)

DOI : doi.org/10.1016/j.polymer.2024.127979

Study on sintering parameters and bonding mechanism of Cu@Ag preform via electromagnetic compaction for power electronics

L. Liu, Q. Wang, S. Robertson, C. Chen, C. Liu, Z. Zhou, C. Tuo, H. Ma, L. Nong

Journal of Alloys and Compounds, 1030, 180842, (2025)

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Enhanced microstructure and mechanical property of large-area nano-Ag joints by porous Cu foam at low temperature

W. Liu, L. Xie, H. Ma, C. Chen, D. Han, Q. Wang, Y. Zou, Z. Chen, L. Liu

Journal of Alloys and Compounds, 1021, 179696, (2025)

DOI : 10.1016/j.jallcom.2025.179696

Decomposition and sintering behaviors of MOD-assisted Ag pastes for power electronics

L. Liu, H. Ma, C. Chen, Z. Xu, L. Nong, Y. Zou, X. Xu, X. Wang, Z. Chen

Mater. Today Commun, 45, 112265, (2025)

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Bonding of non-planarized fine-pitch (10 μm) Cu pillar through Ag cap

Z. Zhang, A. Suetake, A. Katsura, R. Liu, F. Huo, R. Okumura, M. Nishijima, C. Chen, K. Suganuma

IEEE Electron Device Letters, 46, 644-647, (2025)

DOI : 10.1109/LED.2025.3535899

Oxidation-free silver porous sheet bonding onto a bare copper substrate in air,

E. Jo, Y.R. Kim, S. Lee, M. Nishijima, C. Chen, K. Suganuma, Y.B. Park, D. Kim

Materials Letters, 378, 137633, (2025)

DOI : 10.1016/j.matlet.2024.137633

Low temperature Al/AlN joint by Ag sinter paste from 180 °C: Interface formation and joint reliability

C. Chen, L. Liu, F. Huo, D. Kim, S. Lee, W. Li, K. Suganuma

Ceramics International, 51, 16061, (2025)

DOI : 10.1016/j.ceramint.2025.01.444

Accumulative roll 5 cycles forged Cu/Ag multilayered preforms for high-temperature die-attach interconnections

C. Liu, C. Chen, C. Liu, K. Suganuma

Materials Characterization, 221, 114779, (2025)

DOI : 10.1016/j.matchar.2025.114779

Al heat affected zone-less resistance element welded lap joints of Al alloy and 1 GPa class steel: Transition of microstructure and fracture with heat transfer

S. Baek, J. Kim, T. Kwak, T. Lee, H. Lee, C. Chen, P. Geng, N. Ma, S.J. Lee, D. Kim,

J. Mater. Res. Technol., 28, 3541-3565, (2024)

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Effect of thermal-mechanical conditions on strength of silanized Al alloy/CFRTP hybrid joint made by thinning-controlled hot pressing

W. Li, P. Geng, N. Ma, C. Chen

Mater. Today Commun, 38, 108507 , (2024)

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Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations

D. Kim, C. Chen, S. Lee, M.S. Kim, K. Suganuma

Corros. Sci., 226, 111614, (2024)

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Design of Ni-rGO reinforced Sn2.5Ag0.7Cu0.1Ce composite solder based on micro-alloying and composite principles: Microstructure and properties

F. Huo, C. Chen, Z. Zhang, Y. Zhang, A. Suetake, K. Takeshita, Y. Yamaguchi, Y. Momose, K. Zhang, K. Suganuma

J. Mater. Res. Technol, 31, 3591–3603, (2024)

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Toward defect-less and minimized work-hardening loss implementation of Al alloy/high-purity Cu dissimilar lap joints by refill friction stir spot welding for battery tab-to-busbar applications

D. Kim, S. Baek, M. Nishijima, H. Lee, P. Geng, N. Ma, Z. Zhang, H. Park, C. Chen, S. Lee, K. Suganuma

Mater. Sci. Eng, A　892, 146089, (2024)

DOI : 10.1016/j.msea.2023.146089

Size Effect of Nickel-Based Single Crystal Superalloy Revealed by Nanoindentation with Low Strain Rates

X. Long, Z. Shen, J. Li, R. Dong, M. Liu, Y. Su, C. Chen

J. Mater. Res, 29, 2437–2447, (2024)

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Investigation of the Influence of Aluminum Surficial Water on Aluminum-Plastic Hybrids Through a Combined Experimental and Simulation Approach

S. Zhao*, C. Chen*, H. Liang, S. Wang, F. Kimura, Y. Kajihara

Appl. Surf, 656, 159694, (2024)

DOI : 10.1016/j.apsusc.2024.159694

Copper Diffusion into Epoxy Under High Temperature,

S. Zhao*, C. Chen*, M. Nishijima, M. Haga, M. Ueshima, H. Suzuki, H. Takenaka, K. Suganuma,

Mater. Lett., 361, 136157, (2024)

DOI : 10.1016/j.matlet.2024.136157

Effects of High Temperature and High Humidity on The Reliability of Copper/Epoxy Bond

S. Zhao*, C. Chen*, M. Nishijima, R. Okumura, M. Haga, M. Ueshima, H. Suzuki

Appl. Surf. Sci., 660, 159970, (2024)

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Interface Regulation of Micro-Sized Sintered Ag-10Al Composite Based on In-Situ Surface Modification and Enhanced Microstructure Stability in Power Electronic Packaging

F. Huo, C. Chen*, Z. Zhang, Y. Wang, A. Suetake, K. Takeshita, Y. Yamaguchi, K. Suganuma

Mater. Des., 240, 112863, (2024)

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Development of Ag@Si Composite Sinter Joining with Ultra-High Resistance to Thermal Shock Test for SiC Power Device: Experiment Validation and Numerical Simulation

Y. Liu, C. Chen*, Y. Wang, Z. Zhang, R. Liu, M. Ueshima, I. Ota, H. Nishikawa, K. Suganuma

Composites Part B: Engineering, 281, 111519, (2024)

DOI : 10.1016/j.compositesb.2024.111519

Low-Temperature Copper Sinter-Joining Technology for Power Electronics Packaging: A Review

Y. Wang, D. Xu, H. Yan, C.F. Li, C. Chen, W. Li,

Journal of Materials Processing Technology, 332, 118526, (2024)

DOI : 10.1016/j.jmatprotec.2024.118526

Enhancing Thermal-Mechanical Performance of Micron Ag/ZrW2O8 Nanorod Die-Attach Paste with Low Thermal Expansion

Y. Xu, X. Qiu, S. Wang, F. Huo, Y. Su, L. Xu, N. Ma, C. Chen*, K. Suganuma

Journal of Alloys and Compounds, 996, 10638-10650, (2024)

DOI : 10.1109/TPEL.2024.3281234

Development Of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability

C. Chen, A. Suetake, F. Huo, D. Kim, Z. Zhang, M.C. Hsieh, W. Li, N. Wakasugi, K. Takeshita, Y. Yamaguchi, Y. Momose, K. Suganuma

IEEE Trans. Power Electron, 39(9), 10638-10650, (2024)

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Temperature and Thickness-Dependent Silver Hillock Generation Mechanism and Surface Morphology Nature of Direct Plated Silver Layers onto Copper Substrates

Journal of Alloys and Compounds, 997, 174871, (2024)

DOI : 10.1016/j.jallcom.2024.174871

Metastable Phases of Ag–Si: Amorphous Si and Ag-Nodule Mediated Bonding

K.S. Nakayama, M. Nishijima, Y. Zhang, C. Chen, M. Ueshima, K. Suganuma

Scientific Reports , 14 (1), 19618, (2024)

DOI : 10.1038/s41598-024-70298-6

Improved Thermal Shock Reliability of Ag Paste Sintered Joint by Adjusted Coefficient of Thermal Expansion with Ag-Si Atomized Particles Addition

W. Li, C. Chen*, M. Nishijima, M. Ueshima, H. Nishikawa, K. Suganuma

Materials & Design, 246, 113308, (2024)

DOI : 10.1016/j.matdes.2024.113308

Oxidation-Free Silver Porous Sheet Bonding onto A Bare Copper Substrate in Air

E. Jo, Y.R. Kim, S. Lee, N. Masahiko, C. Chen, K. Suganuma, Y.B. Park, D. Kim

Materials Letters, 378, 137633, (2024)

DOI : 10.1016/j.matlet.2024.137633

Driving Forces of Solid-State Cu-To-Cu Direct Bonding Suppressing the Work-Hardening Loss By Refill Friction Stir Spot Welding

S. Lee, S. Baek, S.J. Lee, C. Chen, M. Nishijima, K. Suganuma, H. Utsunomiya, S. Ma, H. Yu, D. Kim

Mater. Sci. Eng. A, 915, 147178, (2024)

DOI : 10.1016/j.msea.2024.147178

Microstructure Characteristics for Improved Thermal Shock Reliability of Sintered AgAl Paste in SiC Power Module

F. Huo, C. Chen*, Z. Zhang, Y. Zhang, A. Suetake, K. Takeshita, Y. Yamaguchi, Y. Momose, K. Suganuma

Mater. Charact., 217, 114360, (2024)

DOI : 10.1016/j.matchar.2024.114360

Effect of Ni Addition and Bath Temperature on Electroless Cu Microstructure in Microvia Preparation for HDI Substrate

Z. Zhang, M.C. Hsieh, M. Nishijima, A. Suetake, H. Yoshida, R. Okumura, C. Chen, H. Seto, K. Hashizume, Y. Kitahara, H. Nagamura, K. Suganuma

Appl. Surf. Sci., 678, 161128, (2024)

DOI : 10.1016/j.apsusc.2024.161128

Structural investigation of nanovoids around the interface of micro-vias by spherical aberration corrected scanning transmission electron microscopy

M.C. Hsieh, M. Nishijima, K. Jogo, Z. Zhang, R. Okumuara, H. Yoshida, C. Chen, A. Suetake, H. Honma, H. Seto, Y. Kitahara, K. Kita, K. Suganuma

Microelectronics Reliability , 150, 115231, (2023)

DOI : https://doi.org/10.1016/j.microrel.2023.115231

Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures

WY Li, CT Chen, M Ueshima, T Kobatake, K Suganuma

Microelectronics Reliability, 150, 115105, (2023)

DOI : https://doi.org/10.1016/j.microrel.2023.115105

Pressureless sinter-joining of micron-Ag flake pastes at 160° C enabled by solvent and interface engineering

Wanli Li, Yitian Li, Yujian Wang, Yuncan Liu, Chuantong Chen, Jie Zhang, Haidong Yan

Journal of Materials Processing Technology, 322, 118207, (2023)

DOI : https://doi.org/10.1016/j.jmatprotec.2023.118207

Controlling the thermal aging and Kirkendall void diffusion speed of sputtered silver interlayers in GaN power semiconductor packaging interfaces for in-wheel motor system integrations

Dongjin Kim, Chuantong Chen, Sangmin Lee, Min-Su Kim, Katsuaki Suganuma

Corrosion Science, 226, 111614, (2023)

DOI : https://doi.org/10.1016/j.corsci.2023.111614

Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules

Yuxin Xu, Xiaoming Qiu, Wangyun Li, Suyu Wang, Ninshu Ma, Minoru Ueshima, Chuantong Chen, Katsuaki Suganuma

Journal of Materials Research and Technology, 26, 1079-1093, (2023)

DOI : https://doi.org/10.1016/j.jmrt.2023.07.254

Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions

Chuantong Chen, Shuaijie Zhao, Takuya Sekiguchi, Katsuaki Suganuma

Journal of Science: Advanced Materials and Devices, 8, 100606, (2023)

DOI : https://doi.org/10.1016/j.jsamd.2023.100606

Interfacial microstructures and corrosion behavior of tungsten heavy alloy/superalloy dissimilar joints: design, regulation and mechanism

Yuxin Xu, Xiaoming Qiu, Suyu Wang, Chuantong Chen, Fei Xing, Katsuaki Suganuma

Journal of Materials Research and Technology, 25, 6323-6337, (2023)

DOI : https://doi.org/10.1016/j.jmrt.2023.07.094

Effects of low melting point SnBi58 alloy on the properties of isotropic conductive adhesives

Weiwei Zhang, Zheng Zhang, Hao Liu, Jianqiang Wang, Fangcheng Duan, Ziwen Lv, Wentong Chen, Xinjie Wang, Mingyu Li, Chuantong Chen, Hongtao Chen

International Journal of Adhesion and Adhesives, 125, 103419, (2023)

DOI : https://doi.org/10.1016/j.ijadhadh.2023.103419

Gaussian filtering method of evaluating the elastic/elasto-plastic properties of sintered nanocomposites with quasi-continuous volume distribution

Yutai Su, Ziyi Shen, Xu Long, Chuantong Chen, Lehua Qi, Xujiang Chao

Materials Science and Engineering: A, 872, 145001, (2023)

DOI : https://doi.org/10.1016/j.msea.2023.145001

Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests

Chuantong Chen, Dongjin Kim, Yang Liu, Takuya Sekiguchi, Yutai Su, Xu Long, Canyu Liu, Changqing Liu, Katsuaki Suganuma

Journal of Materials Research and Technology, 24, 8967-8983, (2023)

DOI : https://doi.org/10.1016/j.jmrt.2023.05.104

Unveiling the damage evolution of SAC305 during fatigue by entropy generation

Xu Long, Ying Guo, Yutai Su, Kim S Siow, Chuantong Chen

International Journal of Mechanical Sciences, 244, 108087, (2023)

DOI : https://doi.org/10.1016/j.ijmecsci.2022.108087

Improving bonding strength of Al/CFRTP hybrid joint through modifying friction spot joining tools

Peihao Geng, Hong Ma, Weihao Li, Kazuki Murakami, Qian Wang, Ninshu Ma, Yasuhiro Aoki, Hidetoshi Fujii, Chuantong Chen

Composites Part B: Engineering, 254, 110588, (2023)

DOI :

Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate

Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hirose Suzuki, Hiroto Takenaka, Hidetoshi Hirahara, Jing Sang, Katsuaki Suganuma

Microelectronics Reliability, 149, 115211, (2023)

DOI : https://doi.org/10.1016/j.microrel.2023.115211

Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature

Shuaijie Zhao, Chuantong Chen, Motoharu Haga, Minoru Ueshima, Hidetoshi Hirahara, Jing Sang, Sung hun Cho, Tohru Sekino, Katsuaki Suganuma

Composites Part B: Engineering, 254, 110562, (2023)

DOI : https://doi.org/10.1016/j.compositesb.2023.110562

Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test

Yue Gao, Jinting Jiu, Chuantong Chen, Katsuaki Suganuma, Rong Sun, Zhi-Quan Liu

Journal of Materials Science & Technology, Volume 115, 10, Pages251 , (2022)

DOI : https://doi.org/10.1016/j.jmst.2021.10.047

Interface-mechanical and thermal characteristics of Ag sinter joining on bare DBA substrate during aging, thermal shock and 1200W/cm2 power cycling tests

Chuantong Chen, Dongjin Kim, Zheng Zhang, Naoki Wakasugi, Yang Liu, Ming-Chun Hsieh, Shuaijie Zhao, Aiji Suetake, Katsuaki Suganuma

IEEE Transactions on Power Electronics, Volume: 37, Issue: 6, (2022)

DOI : https:// doi.org/10.1109/TPEL.2022.3142286

Effects of rotation tool-induced heat and material flow behaviour on friction stir lapped Al/steel joint formation and resultant microstructure

Peihao Geng, Yunwu Ma, Ninshu Ma, Hong Ma, Yasuhiro Aoki, Huihong Liu, Hidetoshi Fujii, Chuantong Chen

International Journal of Machine Tools and Manufacture , 174(1), 103858, (2022)

DOI : DOI: 10.1016/j.ijmachtools.2022.103858

Microstructural and interface geometrical influence on the mechanical fatigue property of aluminum/high-strength steel lap joints using resistance element welding for lightweight vehicles: Experimental and computational investigation

Seungyeop Baek, Gun Yung Go, Jong-Wook Park, Jongho Song, Hyun-chul Lee, Seung-Joon Lee, Sangmin Lee, Chuantong Chen, Min-Su Kim, Dongjin Kim

Journal of Materials Research and Technology, Volume 17, Pages 658-678, (2022)

DOI : DOI: 10.1016/j.jmrt.2022.01.041

Influence of laser welding power on steel/CFRP lap joint fracture behaviors

Xia Hongbo, Yunwu Ma, Chuantong Chen, Jianhui Su, Chengsong Zhang, Caiwang Tan, Li Qun li Li, Peihao Geng, Ninshu Ma

Composite Structures , 285(12), 115247, (2022)

DOI : DOI: 10.1016/j.compstruct.2022.115247

Robust bonding and microstructure behavior of aluminum/high-strength steel lap joints using resistance element welding process for lightweight vehicles: Experimental and numerical investigation

Seungyeop Baek, Seung Yeop Baek, Jongho Song, Hyun-Chul Lee, Seung-Yeon Park, Kuk-Hyun Song, Sangmin Lee, Seung-Joon Lee, Chuantong Chen, Dongjin Kim

Materials Science and Engineering A , 833, 142378, (2022)

DOI : DOI: 10.1016/j.msea.2021.142378

Development of anti-oxidation Ag salt paste for large-area (35× 35 mm2) Cu-Cu bonding with ultra-high bonding strength

Bowen Zhang, Chuantong Chen, Takuya Sekiguchi, Yang Liu, Caifu Li, Katsuaki Suganuma

Journal of Materials Science & Technology, Volume 113, Pages261, (2022)

DOI : https://doi.org/10.1016/j.jmst.2021.08.095

Constitutive, creep, and fatigue behavior of sintered Ag for finite element simulation of mechanical reliability: a critical review

Xu Long, Ying Guo, Yutai Su, Kim S Siow, Chuantong Chen

Journal of Materials Science: Materials in Electronics , volume 33, pages2293, (2022)

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Reverse Analysis of Surface Strain in Elasto-Plastic Materials by Nanoindentation

Xu Long, Ziyi Shen, Changhen Lu, Qipu Jia, Cao Guan, Chuantong Chen, Haodong Wang and Ye Li

International Journal of Applied Mechanics, Vol. 13, No. 09, 2150106, (2021)

DOI : DOI: 10.1142/S1758825121501064

WBG Power Packaging as Key Technology of Energy Consumption Reduction,

Katsuaki Suganuma, Chuantong Chen

Journal of Japan Institute of Electronics Packaging, 24(5), 369-372, (2021)

DOI : DOI: 10.5104/jiep.24.369

Reliability of Ag Sinter-Joining Die Attach Under Harsh Thermal Cycling and Power Cycling Tests

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Katsuaki Suganuma

Journal of Electronic Materials , volume 50, pages6597, (2021)

DOI : https://doi.org/10.1007/s11664-021-09221-y

Failure investigation of a Ag sinter-joining SiC power device under harsh cycling conditions

Zheng Zhang, Chuantong Chen, Aiji Suetake, Tetsu Takemasa, Ming-Chun Hsieh, Yang Liu, Katsuaki Suganuma

ECS Transactions, Volume 104, Number 7, pages93, (2021)

DOI : https://doi.org/10.1149/10407.0093ecst

The Ʃ3 twin dependence of thermo-mechanical fatigue of a polycrystalline high-purity Cu film

Dongjin Kim, Chanyang Choe, Chuantong Chen, Sangmin Lee, Seung-Joon Lee, Semin Park, Seungjun Noh, Katsuaki Suganuma

International Journal of Fatigue, Volume 150, pages106331, (2021)

DOI : https://doi.org/10.1016/j.ijfatigue.2021.106331

Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses

Dongjin Kim, Sangmin Lee, Chuantong Chen, Seung-Joon Lee, Shijo Nagao and Katsuaki Suganuma

J. Mater. Sci, , 56, 9852–9870, (2021)

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Large-scale ceramic–metal joining by nano-grained Ag particles paste sintering in low-temperature pressure-less conditions

Chuantong Chen, Katsuaki Suganuma

Scr. Mater.,, 195, 113747, (2021)

DOI : https://doi.org/10.1016/j.scriptamat.2021.113747

Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test

Chuantong Chen, Zheng Zhang, Dongjin Kim, Tetsuya Sasamura, Yukinori Oda, Ming-Chun Hsieh, AyaI waki, Aiji Suetake, Katsuaki Suganuma

J. Alloys Compd.,, 862, 158596, (2021)

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Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma

Scr. Mater., , 198, 113833, (2021)

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Improved thermal cycling reliability of Ag sinter joining by optimized chip mounting speed and push depth

Tetsu Takemasa, Chuantong Chen & Katsuaki Suganuma

J. Mater. Sci-Mater. El., , (on-line published), (2021)

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Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test

Yang Liu, Chuantong Chen, Dongjin Kim, Zheng Zhang, Xu Long & Katsuaki Suganuma

J. Mater. Sci-Mater. El.,, (on-line published), (2021)

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Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion

Tomohito Iwashige, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Yuichi Sakuma, Seigo Kurosaka, Yukinori Oda, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

J. Mater. Sci,, 55, 644-659., (2020)

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Micron-sized Ag flake particles direct die bonding on electroless Ni–P-finished DBC substrate: low-temperature pressure-free sintering, bonding mechanism and high-temperature aging reliability

Chuantong Chen, Zheng Zhang, Bowen Zhang, Katsuaki Suganuma,

J. Mater. Sci-Mater. El.,, 31, 1247–1256., (2020)

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Well-controlled decomposition of copper complex inks enabled by metal nanowire networks for highly compact, conductive, and flexible copper films

Bowen Zhang, Chuantong Chen, Wanli Li, Jeyun Yeom, Katsuaki Suganuma

Adv. Mater. Interfaces, , 7, 1901550, (2020)

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Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint

Dongjin Kim, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

J. Mater. Sci-Mater. El.,, 31, 587–598, (2020)

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3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste

Chuantong Chen, Yue Gao, Zhi-Quan Liu, Katsuaki Suganuma

Scripta. Mater.,, 179, 36-39., (2020)

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Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules

Dongjin Kim, Chuantong Chen, Seung-joon Lee, Shijo Nagao, Katsuaki Suganuma

J. Mater. Sci-Mater. El.,, 31, 3715–3726., (2020)

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Robust bonding and thermal-stable Ag-Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less

Chuantong Chen, Zheng Zhang, Qian Wang, Bowen Zhang, Yue Gao, Tetsuya Sasamura, Yukinori oda, Ninshu Ma, Katsuaki Suganuma

J. Alloy. Compd., 828, 154397., (2020)

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Real-time acoustic emission monitoring of wear-out failure in SiC power electronic devices during power cycling tests

ChanYang Choe, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma

IEEE T Power Electr, , (on-line published), (2020)

DOI : https://doi.org/10.1109/TPEL.2020.3024986

Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature

Chuantong Chen, Chanyang Choe, Dongjin Kim, Katsuaki Suganuma

J. Electron. Mater, , (on-line published), (2020)

DOI : https://doi.org/10.1007/s11664-020-08410-5

Reactive wafer bonding with nanoscale Ag/Cu multilayers

Yu-chen Liu, Shih-kang Lin, Hao Zhang, Shijo Nagao, Chuantong Chen, Katsuaki Suganuma

Scripta. Mater.,, 184, 1-5., (2020)

DOI : https://doi.org/10.1016/j.scriptamat.2020.03.043

Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release

Chuantong Chen, Katsuaki Suganuma

Sci Rep,, 10, 9042., (2020)

DOI : https://doi.org/10.1038/s41598-020-66069-8

Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro

Chuantong Chen, Chanyang Choe, Dongjin Kim, Zheng Zhang, Xu Long, Zheng Zhou, Fengshun Wu, Katsuaki Suganuma

J. Alloy. Compd. , 843, 155173., (2020)

DOI : https://doi.org/10.1016/j.jallcom.2020.155173

Fracture mechanism and strength evaluation of Al5052/CFRP joint produced by coaxial one-side resistance spot welding

Sendong Ren, Yunwu Ma, Shuhei Saeki, Yoshiaki Iwamoto, Chuantong Chen, NinshuMa

Compos Struct,, 252, 112766, (2020)

DOI : https://doi.org/10.1016/j.compstruct.2020.112766

On-line thermal resistance and reliability characteristic monitoring of power modules with Ag sinter joining and Pb, Pb-free solders during power cycling test by SiC TEG chip

Dongjin Kim, Shijo Nagao, Chuantong Chen, Naoki Wakasugi, Yasuyuki Yamamoto, Aiji Suetake, Tetsu Takemasa, Tohru Sugahara, Katsuaki Suganuma

IEEE T Power Electr,, (on-line published), (2020)

DOI : https://doi.org/10.1109/TPEL.2020.3031670

Fracture mechanism and strength evaluation of Al5052/CFRP joint produced by coaxial one-side resistance spot welding

Sendong Ren, Yunwu Ma, Shuhei Saeki, Yoshiaki Iwamoto, Chuantong Chen, NinshuMa

Compos Struct,, 252, 112766, (2020)

DOI : https://doi.org/10.1016/j.compstruct.2020.112766