研究成果

1. Effect of W content in Co-W-P metallization on both oxidation resistance and resin adhesion

Tomohito Iwashige, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Yuichi Sakuma, Seigo Kurosaka, Yukinori Oda, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma
J. Mater. Sci, 55 (2020) 644-659.
DOI:https://doi.org/10.1007/s10853-019-04028-z

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2. Micron-sized Ag flake particles direct die bonding on electroless Ni–P-finished DBC substrate: low-temperature pressure-free sintering, bonding mechanism and high-temperature aging reliability

Chuantong Chen, Zheng Zhang, Bowen Zhang, Katsuaki Suganuma,
J. Mater. Sci-Mater. El., 31(2020) 1247–1256.
DOI:https://doi.org/10.1007/s10854-019-02636-8

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3. Well-controlled decomposition of copper complex inks enabled by metal nanowire networks for highly compact, conductive, and flexible copper films

Bowen Zhang, Chuantong Chen, Wanli Li, Jeyun Yeom, Katsuaki Suganuma
Adv. Mater. Interfaces, 7 (2020) 1901550
DOI:https://doi.org/10.1002/admi.201901550

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4. Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint

Dongjin Kim, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma
J. Mater. Sci-Mater. El., 31 (2020), 587–598
DOI:https://doi.org/10.1007/s10854-019-02563-8

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5. 3D pyramid-shape Ag plating assisted interface connection growth of sinter micron-sized Ag paste

Chuantong Chen, Yue Gao, Zhi-Quan Liu, Katsuaki Suganuma
Scripta. Mater.,179 (2020) 36-39.
DOI:https://doi.org/10.1016/j.scriptamat.2019.12.040

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6. Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules

Dongjin Kim, Chuantong Chen, Seung-joon Lee, Shijo Nagao, Katsuaki Suganuma
J. Mater. Sci-Mater. El., 31 (2020) 3715–3726.
DOI:https://doi.org/10.1007/s10854-020-02930-w

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7. Robust bonding and thermal-stable Ag-Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less

Chuantong Chen, Zheng Zhang, Qian Wang, Bowen Zhang, Yue Gao, Tetsuya Sasamura, Yukinori oda, Ninshu Ma, Katsuaki Suganuma
J. Alloy. Compd. 828 (2020) 154397.
DOI:https://doi.org/10.1016/j.jallcom.2020.154397

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8. Real-time acoustic emission monitoring of wear-out failure in SiC power electronic devices during power cycling tests

ChanYang Choe, Chuantong Chen, Shijo Nagao, Katsuaki Suganuma
IEEE T Power Electr, (2020) (on-line published)
DOI:https://doi.org/10.1109/TPEL.2020.3024986

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9. Lifetime Prediction of a SiC Power Module by Micron/Submicron Ag Sinter Joining Based on Fatigue, Creep and Thermal Properties from Room Temperature to High Temperature

Chuantong Chen, Chanyang Choe, Dongjin Kim, Katsuaki Suganuma
J. Electron. Mater, (2020) (on-line published)
DOI:https://doi.org/10.1007/s11664-020-08410-5

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10. Reactive wafer bonding with nanoscale Ag/Cu multilayers

Yu-chen Liu, Shih-kang Lin, Hao Zhang, Shijo Nagao, Chuantong Chen, Katsuaki Suganuma
Scripta. Mater.,184 (2020) 1-5.
DOI:https://doi.org/10.1016/j.scriptamat.2020.03.043

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11. Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release

Chuantong Chen, Katsuaki Suganuma
Sci Rep,10(2020)9042.
DOI:https://doi.org/10.1038/s41598-020-66069-8

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12. Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro

Chuantong Chen, Chanyang Choe, Dongjin Kim, Zheng Zhang, Xu Long, Zheng Zhou, Fengshun Wu, Katsuaki Suganuma
J. Alloy. Compd. 843 (2020) 155173.
DOI:https://doi.org/10.1016/j.jallcom.2020.155173

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13. Fracture mechanism and strength evaluation of Al5052/CFRP joint produced by coaxial one-side resistance spot welding

Sendong Ren, Yunwu Ma, Shuhei Saeki, Yoshiaki Iwamoto, Chuantong Chen, NinshuMa
Compos Struct, 252 (2020), 112766
DOI:https://doi.org/10.1016/j.compstruct.2020.112766

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14. On-line thermal resistance and reliability characteristic monitoring of power modules with Ag sinter joining and Pb, Pb-free solders during power cycling test by SiC TEG chip

Dongjin Kim, Shijo Nagao, Chuantong Chen, Naoki Wakasugi, Yasuyuki Yamamoto, Aiji Suetake, Tetsu Takemasa, Tohru Sugahara, Katsuaki Suganuma
IEEE T Power Electr, (2020) (on-line published)
DOI:https://doi.org/10.1109/TPEL.2020.3031670

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15. Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses

Dongjin Kim, Sangmin Lee, Chuantong Chen, Seung-Joon Lee, Shijo Nagao and Katsuaki Suganuma
J. Mater. Sci, 56 (2021) 9852–9870
DOI:https://doi.org/10.1007/s10853-021-05924-z

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16. Large-scale ceramic–metal joining by nano-grained Ag particles paste sintering in low-temperature pressure-less conditions

Chuantong Chen, Katsuaki Suganuma
Scr. Mater., 195 (2021) 113747
DOI:https://doi.org/10.1016/j.scriptamat.2021.113747

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17. Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test

Chuantong Chen, Zheng Zhang, Dongjin Kim, Tetsuya Sasamura, Yukinori Oda, Ming-Chun Hsieh, AyaI waki, Aiji Suetake, Katsuaki Suganuma
J. Alloys Compd., 862 (2021)158596
DOI:https://doi.org/10.1016/j.jallcom.2021.158596

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18. Pressureless and low-temperature sinter-joining on bare Si, SiC and GaN by a Ag flake paste

Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma
Scr. Mater., 198 (2021) 113833
DOI:https://doi.org/10.1016/j.scriptamat.2021.113833

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19. Improved thermal cycling reliability of Ag sinter joining by optimized chip mounting speed and push depth

Tetsu Takemasa, Chuantong Chen & Katsuaki Suganuma
J. Mater. Sci-Mater. El., (2021) (on-line published)
DOI:https://doi.org/10.1007/s10854-021-06513-1

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20. Modified Ni/Pd/Au-finished DBA substrate for deformation-resistant Ag–Au joint during long-term thermal shock test

Yang Liu, Chuantong Chen, Dongjin Kim, Zheng Zhang, Xu Long & Katsuaki Suganuma
J. Mater. Sci-Mater. El., (2021) (on-line published)
DOI:https://doi.org/10.1007/s10854-021-06549-3

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