研究成果

2020年

  1. Sinter Joining Technology for WBG(Plenary)
    K. Suganuma
    21th International Symposium on Eco-Materials Processing and Design, Univ. Science and Technology Beijing/ IU-MRS, Yantai, China, January 12-15, 2020.
  2. Fatigue and Creep Properties of Sintered Ag Paste from Room Temperature to High Temperature
    Chuantong Chen, Chanyang Choe, Aiji Suetake, Katsuaki Suganuma
    TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings, February 23-27, 2020 | San Diego, California, USA.
  3. Advanced SiC power module packaging technology direct on DBA substrate for high temperature applications
    Chuantong Chen, Zheng Zhang, Dongjin Kim, Katsuaki Suganuma
    2020 IEEE Applied Power Electronics Conference and Exposition (APEC) ,15-19 March 2020. New Orleans, LA, USA.
  4. Advanced SiC power module packaging technology direct on DBA substrate for high temperature applications: Ag sinter joining and encapsulation resin adhesion
    Chuantong Chen, Zheng Zhang, Katsuaki Suganuma
    2020 IEEE 70th Electronic Components and Technology Conference (ECTC), May26-29, 2020, Virtual conference.
  5. Thermal evaluation of metalized ceramic substrates for use in next-generation power modules toward international standardization
    Naoki Wakasugi, Chuantong Chen, Kiyoshi Hirao, Shijo Nagao, Katsuaki Suganuma
    2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), SEP 15-18, 2020, Virtual conference.
  6. Evaluation of high temperature reliability of SiC die attached structure with sinter micron-size Ag particles paste on Ni-P/Pd/Au plated substrates
    Chuantong Chen, Zheng Zhang, Katsuaki Suganuma
    2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), SEP 15-18, 2020, Virtual conference.
  7. Advances in Ag Sinter Joining for WBG Power Device Assembly and High Temperature Reliability(invited)
    Katsuaki Suganuma, Chuantong Chen, Zheng Zhang, Aishi Suetake, Ming Chun Hsieh, Aya Iwaki
    Pacific Rim Meeting on Electrochemical and Solid State Science (PRiME 2020), October 4-9, 2020, Virtual conference.
  8. AE Monitoring of Fatigue Damage of Al Ribbon Bonding for Power Electronic Devices During Power Cycling Test
    Katsuaki Suganuma, Chanyang Choe, Chuantong Chen
    53rd International Symposium on Microelectronics, (IMAPS 2020), October 4-9, 2020, Virtual conference.

2021年

  1. Reliability Evaluation of Ag Sinter-Joining Die Attach Under a Harsh Thermal Cycling Test
    Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma
    TMS 2021 150th Annual Meeting & Exhibition, March 15-18, 2021, Virtual conference.
  2. Advances in low temperature/low pressure Ag sinter joining and its thermal performance(invited)
    Katsuaki Suganuma, Chuantong Chen, Zheng Zhang, Aiji Suetake, Aya Iwaki, Ming-Chun Hsieh, and Naoki Satoh
    TMS 2021 150th Annual Meeting & Exhibition, March 15-18, 2021
  3. Pressureless and Low Temperature Direct Bonding on Si, SiC and GaN via Ag Paste Sinter-joining
    Zheng Zhang, Chuantong Chen, Aiji Suetake, Ming-Chun Hsieh, Aya Iwaki, Katsuaki Suganuma
    2021 International Conference on Electronics Packaging (ICEP), May 2, 2021
  4. Advances in Ag Sinter Joining and real‐time failure monitoring for WBG Power Device
    C. Chen, Z. Zhang, T. Takemasa, N. Wakasugi, A. Suetake, K. Suganuma
    3rd International Symposium on 3D Power Electronics Integration & Manufacturing(3D-PEIM), June 22, 2021